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Bill Amend does it better than anybody else. His ability to present middle-class family life in a way that?s consistently fresh, irreverent, and downright wacky is unsurpassed. If asked?and they are each day they open the more than 1,000 newspapers that carry his strip?Amend?s audience of 25 million readers would say the same thing.That committed and connected audience will be delighted once again to discover Who?s Up for Some Bonding?, the latest in a series that includes 18 previous collections and eight treasuries, amounting to nearly two million FoxTrot books in circulation. This time around, Amend?s antics with the Fox family include the artist?s invitingly skewed views of ?normal? life: children who are light-years ahead of their parents when it comes to computers, siblings who could teach the CIA a thing or two about covert and ?get-even? ops, and parents who stumble around in a slight daze as they deal with all the ?amenities? of the modern world.Jason, Peter, Paige, and their parents, Roger and Andy, deliver the laughs. They all bring their unique personalities and perspectives to the FoxTrot world, whether the subject is technology, tofu recipes . . . or a son convinced he could be the next zillionaire Martha Stewart. FoxTrot surprises. FoxTrot charms. FoxTrot always satisfies.
Ideal for undergraduate and first-year graduate courses in chemical bonding, Chemical Bonding and Molecular Geometry: From Lewis to Electron Densities can also be used in inorganic chemistry courses. Authored by Ronald Gillespie, a world-class chemist and expert on chemical bonding, and Paul Popelier of the University of Manchester Institute of Science and Technology, this text provides students with a comprehensive and detailed introduction to the principal models and theories of chemical bonding and geometry. It also serves as a useful resource and an up-to-date introduction to modern developments in the field for instructors teaching chemical bonding at any level.
This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students.
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